Packaging of Microfluidic Devices for Fluid Interconnection Using Thermoplastics
نویسندگان
چکیده
منابع مشابه
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ژورنال
عنوان ژورنال: Journal of Microelectromechanical Systems
سال: 2009
ISSN: 1057-7157,1941-0158
DOI: 10.1109/jmems.2009.2013404